Vapor chamber, electronic device and vapor chamber production method

• Main Authors: OTA, TAKAYUKI, KOZURU, YOUJI, YAMAKI, MAKOTO, KIURA, SHINYA, TAKAHASHI, SHINICHIRO, TAKEDA, TOSHIHIKO, ODA, KAZUNORI, TERAUCHI, TAKAYUKI, TAKAHASHI, NAOHIRO
• Format: Patent
• Language: Chinese; English
• Published: 16.08.2023
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEAT EXCHANGE IN GENERAL; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEATING; LIGHTING; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MECHANICAL ENGINEERING; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; WEAPONS

A body sheet of a vapor chamber according to the present invention includes a plurality of first land portions. A first sheet outer surface of a first sheet includes a first junction region that overlaps a first land portion and a first space region that overlaps a space portion. The vapor chamber includes a curved region that is curved along a curve which extends in a direction intersecting with a first direction in plan view of the vapor chamber. A maximum dimension that is delimited between the first junction region and the first space region and that is in the thickness direction of the first sheet is defined as a first maximum dimension. When viewed along a direction parallel with the curve, the first maximum dimension in the curved region is greater than the first maximum dimension in a region other than the curved region.