Water vapor plasma to enhance surface hydrophilicity

Methods and apparatus for processing a substrate area provided herein. For example, methods for enhancing surface hydrophilicity on a substrate comprise (a) supplying, using a remote plasma source, water vapor plasma to a processing volume of a plasma processing chamber to treat a bonding surface of...

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Main Authors BERGMAN, ERIC J, MOHAMED HELMI ISIK, NUR YASMEEN ADDINA, SUDIJONO, JOHN LEONARD, LIM, YIN WEI, YONG, WEI YING DOREEN, LIANTO, PRAYUDI, GOH, YI KUN KELVIN, SEE, GUAN HUEI, PAPANU, JAMES S, SUNDARRAJAN, ARVIND, SAHMUGANATHAN, VICKNESH
Format Patent
LanguageChinese
English
Published 01.08.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Methods and apparatus for processing a substrate area provided herein. For example, methods for enhancing surface hydrophilicity on a substrate comprise (a) supplying, using a remote plasma source, water vapor plasma to a processing volume of a plasma processing chamber to treat a bonding surface of the substrate, (b) supplying at least one of microwave power or RF power at a frequency from about 1 kHz to 10 GHz and a power from about 1 kW to 10 kW to the plasma processing chamber to maintain the water vapor plasma within the processing volume during operation, and (c) continuing (a) and (b) until the bonding surface of the substrate has a hydrophilic contact angle of less than 10DEG.
Bibliography:Application Number: TW202211132908