Photosensitive resin composition, photosensitive resin laminate, and resist pattern formation method

• Main Authors: UNO, DAISUKE, NISHIMOTO, HIDEAKI, SAKURAI, TAKAAKI, MATSUO, YUKI
• Format: Patent
• Language: Chinese; English
• Published: 01.08.2023
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP

The present invention provides a photosensitive resin composition that has various improved characteristics as a result of the types and proportions of at least the acid comonomer components of the comonomer components of an alkali-soluble polymer being controlled. According to the present invention, a photosensitive resin composition includes the following components: (A) an alkali-soluble polymer; (B) a compound that has an ethylenically unsaturated bond; (C) and a photopolymerization initiator. The (A) component includes structural units derived from at least the following comonomer components: (a) methacrylic acid or acrylic acid; (b) a carboxylic acid that is different from the acid selected as the (a) component; and (c) a compound that has an aromatic structure or an alicyclic structure. The ratio (mass fraction (a1)/mass fraction (b1)) between the mass fraction (a1) of the structural units of the (A) component that are derived from the (a) component and the mass fraction (b1) of the structural units th