Electronic devices and methods of manufacturing electronic devices
In one example, an electronic device includes a substrate, which has a dielectric structure includes a dielectric structure top side and a dielectric structure bottom side opposite to the dielectric structure top side, and a conductive structure comprising a protruded via that extends from the diele...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
16.07.2023
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Subjects | |
Online Access | Get full text |
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Summary: | In one example, an electronic device includes a substrate, which has a dielectric structure includes a dielectric structure top side and a dielectric structure bottom side opposite to the dielectric structure top side, and a conductive structure comprising a protruded via that extends from the dielectric structure bottom side. An electronic component is coupled to the conductive structure at the dielectric structure top side, and a terminal is coupled to the protruded via such that the protruded via extends into the terminal. Other examples and related methods are also disclosed herein. |
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Bibliography: | Application Number: TW20220144599 |