Adhesive resin composition

• Main Authors: SAKAMOTO, KOICHI, MIKAMI, TADAHIKO, MIEDA, HIROYUKI
• Format: Patent
• Language: Chinese; English
• Published: 16.07.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; PRINTED CIRCUITS; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

The adhesive resin composition of the present invention comprises a polyester resin (A), and satisfies the requirements of: (i) the adhesive resin composition substantially does not contain any curing agent; (ii) a tetrahydrofuran-nonsoluble component of the adhesive resin composition when treated at 200 DEG C for 1 hour is 10% by mass or more. The adhesive resin composition exhibits a good pot-life property even without containing any curing agent, and exhibits excellent properties such as solder-heat resistance and adhesiveness to various substrates. The present invention also provides a laminate or an adhesive sheet having an adhesive layer consisting of the adhesive resin composition; a print wiring board or a packaging material comprising the laminate as a constituent component; and a laminated film for decorating a 3D molded product or a film for laminating a metal can comprising the adhesive sheet as a constituent component.