Mounting structure for semiconductor element, and combination of semiconductor element and substrate

• Main Authors: ONOZEKI, HITOSHI, FUKUZUMI, SHIZU, SUZUKI, NAOYA, NONAKA, TOSHIHISA
• Format: Patent
• Language: Chinese; English
• Published: 01.07.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A mounting structure for a semiconductor element, in which a semiconductor element having an element electrode, and a substrate having a substrate electrode provided at a position opposed to the element electrode on a surface of the substrate facing the semiconductor element, are connected via the element electrode and the substrate electrode, and in which one of the element electrode or the substrate electrode is a first protruding electrode having a solder layer on a tip portion, the other of the element electrode or the substrate electrode is a first electrode pad having one or more metal protrusions on a surface of the electrode pad, the metal protrusion of the first electrode pad penetrates into the solder layer of the first protruding electrode, and a bottom area of the metal protrusion of the first electrode pad is less than 70% of an area of the first electrode pad, or less than 75% of a maximum cross-sectional area of the solder layer of the first protruding electrode having the solder layer on the t