Electronic package and manufacturing method thereof

An electronic package is provided in which a first antenna structure and a second antenna structure integrates on a package module, and a radio frequency of the first antenna structure is different from a radio frequency of the second antenna structure, so that the electronic package can be send/rec...

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Bibliographic Details
Main Authors CHEN, LIANG-PIN, KE, CHUNG-YU
Format Patent
LanguageChinese
English
Published 01.07.2023
Subjects
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An electronic package is provided in which a first antenna structure and a second antenna structure integrates on a package module, and a radio frequency of the first antenna structure is different from a radio frequency of the second antenna structure, so that the electronic package can be send/receive different antenna signals. Therefore, an electronic product using the electronic package can transmit the signal of the required frequency, and improve an antenna function thereof.
Bibliography:Application Number: TW202110149402