Benzoxazine resin, composition thereof and copper clad made therefrom wherein the composition includes benzoxazine resin, fillers, thermoset resins and toughening agents

• Main Authors: CHOU, YA-YEN, CHEN, CHENGUNG, CIOU, JHENG-HONG, YANG, MIN-YUAN, LIAO, SHIH-HAO
• Format: Patent
• Language: Chinese; English
• Published: 01.07.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP

A benzoxazine resin includes compounds of the following formula 1-1, wherein, R 1 , R 2 and R 3 are as defined in the specification. The invention also discloses a resin composition. The resin composition includes 25 to 50 weight percents of the benzoxazine resin, 35 to 50 percents of fillers, 6 to 15 weight percents of thermoset resins and 8 to 15 weight percents of toughening agents. The invention also discloses a copper clad including the resin composition.