Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

In one embodiment, a semiconductor manufacturing apparatus includes a container configured to contain a substrate, a heater configured to heat the substrate contained in the container, and an injector configured to feed gas to the substrate contained in the container. Furthermore, the injector inclu...

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Bibliographic Details
Main Authors OMOTO, SEIICHI, MATSUI, TAKAYUKI, FUJITA, JUNYA
Format Patent
LanguageChinese
English
Published 16.06.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:In one embodiment, a semiconductor manufacturing apparatus includes a container configured to contain a substrate, a heater configured to heat the substrate contained in the container, and an injector configured to feed gas to the substrate contained in the container. Furthermore, the injector includes a first layer having a tubular shape, and a second layer provided on a surface of the first layer, and having an emissivity of 0.5 or less.
Bibliography:Application Number: TW202211122856