Electrical connection assembly for test connector including a probe board and a wire type conductive film disposed on the probe board
An electrical connection assembly for a test connector is used in a semiconductor test system and served as a medium for electrical connection between an object under test, such as a semiconductor element or a wafer, and a test circuit board. The electrical connection assembly includes a probe board...
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Main Author | |
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Format | Patent |
Language | Chinese English |
Published |
16.06.2023
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Subjects | |
Online Access | Get full text |
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Summary: | An electrical connection assembly for a test connector is used in a semiconductor test system and served as a medium for electrical connection between an object under test, such as a semiconductor element or a wafer, and a test circuit board. The electrical connection assembly includes a probe board and a wire type conductive film disposed on the probe board. Each probe of the probe board forms an oblique guide part with the same oblique direction at a contact end facing the same axial end of the wire type conductive film. Each probe can electrically contact the wire group corresponding to the position of the conductive film. The guiding effect of directional mutual extrusion and deformation of the contact wire group is generated through the oblique guide part of the contact end so that the direction of mutual extrusion and deformation of the forced wire group is controlled to be consistent and the contact point of the object under test is in correct electrical contact with the corresponding probe through the |
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Bibliography: | Application Number: TW202211121618 |