Photosensitive resin composition, photosensitive resin layer using the same, filter and display device

• Main Authors: SONG, HAE-NI, YOO, JEONG-HO, PARK, BAEK-SOUNG, KIM, SABINA, KIM, JI-HYE, KIM, JI-HONG
• Format: Patent
• Language: Chinese; English
• Published: 16.06.2023
• Subjects: ADHESIVES; APPARATUS SPECIALLY ADAPTED THEREFOR; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; DYES; ELECTROGRAPHY; FREQUENCY-CHANGING; HOLOGRAPHY; LAKES; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MATERIALS THEREFOR; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; MORDANTS; NATURAL RESINS; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICAL LOGIC ELEMENTS; OPTICS; ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PAINTS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; POLISHES; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; THEIR PREPARATION OR CHEMICAL WORKING-UP

This disclosure relates to a photosensitive resin composition, and a photosensitive resin layer, a color filter and display device using the same. Specifically, an embodiment provides a photosensitive resin composition including (A) a photopolymerizable compound; (B) a photopolymerization initiator; (C) a colorant; (D) a binder resin; and (E) a solvent, wherein the solvent includes a first solvent and a second solvent, the first solvent has a boiling point of less than about 150 DEG C (provided that greater than about 0 DEG C) under 1 atm and the second solvent has a boiling point of greater than or equal to about 150 DEG C under 1 atm, and the first solvent is included in an amount greater than that of the second solvent.