Method of producing a substrate and system for producing a substrate

• Main Authors: PRIEWASSER, KARL HEINZ, HOSHINO, HITOSHI
• Format: Patent
• Language: Chinese; English
• Published: 16.06.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The invention relates to a method of producing a substrate (16) with a functional layer (12). The method comprises providing a workpiece (2) having a first surface (4) and a second surface (6) opposite the first surface (4), and forming a modified layer (8) inside the workpiece (2), the modified layer (8) comprising a plurality of modified regions. Further, the method comprises, after forming the modified layer (8) inside the workpiece (2), forming the functional layer (12) on the first surface (4) of the workpiece (2) and, after forming the functional layer (12) on the first surface (4) of the workpiece (2), dividing the workpiece (2) along the modified layer (8), thereby obtaining the substrate (16) with the functional layer (12). Dividing the workpiece (2) along the modified layer (8) comprises applying an external stimulus to the workpiece (2). Moreover, the invention relates to a substrate producing system for performing this method.