Electronic device
An electronic device includes a housing, a heat dissipation element, and a thermal deformation lifting element. The housing includes a bottom plate including at least one opening. The heat dissipation element is disposed in the housing. The thermal deformation lifting element is connected to the hea...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
01.06.2023
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Subjects | |
Online Access | Get full text |
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Summary: | An electronic device includes a housing, a heat dissipation element, and a thermal deformation lifting element. The housing includes a bottom plate including at least one opening. The heat dissipation element is disposed in the housing. The thermal deformation lifting element is connected to the heat dissipation element and includes an abutting portion. The abutting portion is at a potion corresponding to the opening. The thermal deformation lifting element is suitable for absorbing a heat of the heat dissipation element to generate a thermal deformation, such that the abutting portion moves away from the opening of the bottom plate to an outside of the housing to lift the bottom plate. |
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Bibliography: | Application Number: TW202110142819 |