Vias including a porous electrically conductive material and methods for fabricating the vias

• Main Authors: JOSHI, DHANANJAY, OKORO, CHUKWUDI AZUBUIKE, GARNER, SEAN MATTHEW
• Format: Patent
• Language: Chinese; English
• Published: 16.05.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A via includes a substrate and a porous electrically conductive material. The substrate includes a first surface and a second surface opposite to the first surface. The substrate includes a through-hole extending from the first surface to the second surface. The porous electrically conductive materi...