Vias including a porous electrically conductive material and methods for fabricating the vias

A via includes a substrate and a porous electrically conductive material. The substrate includes a first surface and a second surface opposite to the first surface. The substrate includes a through-hole extending from the first surface to the second surface. The porous electrically conductive materi...

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Bibliographic Details
Main Authors JOSHI, DHANANJAY, OKORO, CHUKWUDI AZUBUIKE, GARNER, SEAN MATTHEW
Format Patent
LanguageChinese
English
Published 16.05.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A via includes a substrate and a porous electrically conductive material. The substrate includes a first surface and a second surface opposite to the first surface. The substrate includes a through-hole extending from the first surface to the second surface. The porous electrically conductive material extends through the through-hole. The porous electrically conductive material includes a first porosity in a central region of the through-hole and a second porosity less than the first porosity proximate the first surface and the second surface of the substrate.
Bibliography:Application Number: TW202211136895