A device and method for temperature monitoring of a power transistor formed in a first semiconductor die
A method and device for temperature monitoring of a power transistor formed in a semiconductor die comprising are disclosed. A side of a temperature-sensing resistor disposed in the semiconductor die is coupled to a voltage input side of the power transistor. A controller coupled to a second side of...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
16.05.2023
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Subjects | |
Online Access | Get full text |
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Summary: | A method and device for temperature monitoring of a power transistor formed in a semiconductor die comprising are disclosed. A side of a temperature-sensing resistor disposed in the semiconductor die is coupled to a voltage input side of the power transistor. A controller coupled to a second side of the temperature-sensing resistor is configured to detect a voltage across the resistor and trigger a temperature related corrective action using the detected voltage. |
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Bibliography: | Application Number: TW202211142256 |