A device and method for temperature monitoring of a power transistor formed in a first semiconductor die

A method and device for temperature monitoring of a power transistor formed in a semiconductor die comprising are disclosed. A side of a temperature-sensing resistor disposed in the semiconductor die is coupled to a voltage input side of the power transistor. A controller coupled to a second side of...

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Main Authors WANG, ZHEN-YU, ANKITITRAKUL, SITTHIPONG, WANG, XIAO-BIN, YIN, JIAN, BARTHOLOMEUSZ, CHRISTOPHER BEN, GUAN, LING-PENG
Format Patent
LanguageChinese
English
Published 16.05.2023
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Summary:A method and device for temperature monitoring of a power transistor formed in a semiconductor die comprising are disclosed. A side of a temperature-sensing resistor disposed in the semiconductor die is coupled to a voltage input side of the power transistor. A controller coupled to a second side of the temperature-sensing resistor is configured to detect a voltage across the resistor and trigger a temperature related corrective action using the detected voltage.
Bibliography:Application Number: TW202211142256