TMV packaging structure with signal heat separation function and manufacturing method thereof

• Main Authors: FENG, LEI, HUANG, BEN-XIA, HONG, YE-JIE, HUANG, GAO, CHEN, XIAN-MING
• Format: Patent
• Language: Chinese; English
• Published: 01.05.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a TMV packaging structure with the signal heat separation function and a manufacturing method thereof. The TMV packaging structure comprises an insulating medium material body, an inner signal line layer, an outer signal line layer, a heat dissipation metal face and a chip, the insulating medium material body is provided with a first side and a second side which are opposite, and the first side of the insulating medium material body is provided with an isolation layer; the inner signal line layer is arranged in the insulating medium material body, the outer signal line is arranged on the surface of the second side of the insulating medium material body and is connected with the inner signal line layer through a TMV structure, the heat dissipation metal face is arranged on the surface of the first side of the insulating medium material body, and the heat dissipation metal face and the inner signal line layer are separated through the isolation layer. The chip is embedded in the insulati