Method of transferring sticker and transfer device with special board

• Main Authors: LAI, YEN-HUEI, YU, CHIH-YU, LIN, CHIAO-YEN
• Format: Patent
• Language: Chinese; English
• Published: 16.04.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CONVEYING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HANDLING THIN OR FILAMENTARY MATERIAL; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PACKING; PERFORMING OPERATIONS; PNEUMATIC TUBE CONVEYORS; PRINTED CIRCUITS; SHOP CONVEYOR SYSTEMS; STORING; TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING; TRANSPORTING

A method of transferring sticker includes the following steps: moving a carrier film with a sticker from a feeding area to a bonding area; setting a special board above a first transfer platform, and moving the special board and the first transfer platform from the feeding area to the bonding area; moving up the special board and the first transfer platform until the special board and the adhesive on the carrier film are in contact with each other; removing a gripper on both sides of the carrier film; moving down the first transfer platform until the first transfer platform is separated from the special board; and moving the first transfer platform from the bonding area to the feeding area.