Lead frame material and method for producing same, and semiconductor package

The present invention provides: a lead frame material which exhibits excellent adhesion to a resin even in the cases where the lead frame material is used in a high-temperature high-humidity environment for a long period of time, and which is not susceptible to the occurrence of particle fall-off; a...

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Bibliographic Details
Main Authors HASHIMOTO, MAKOTO, KUZUHARA, SOKI, OOUCHI, KAZUHIRO
Format Patent
LanguageChinese
English
Published 01.04.2023
Subjects
APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
SEMICONDUCTOR DEVICES
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Summary:The present invention provides: a lead frame material which exhibits excellent adhesion to a resin even in the cases where the lead frame material is used in a high-temperature high-humidity environment for a long period of time, and which is not susceptible to the occurrence of particle fall-off; a method for producing this lead frame material; and a semiconductor package which uses this lead frame material. A lead frame material 1 according to the present invention comprises a conductive base material 10 and a surface coating film 30 that is formed on at least a part of the surface of the base material 10; the surface coating film 30 comprises at least one roughened layer 3; and the space volume (Vv) and the protrusion entity volume (Vmp) as determined by measuring the surface properties of the surface coating film with use of a laser roughness meter are within the range of 0.6 cm3/m2 to 5.1 cm3/m2 and the range of 0.02 cm3/m2 to 0.30 cm3/m2, respectively.
Bibliography:Application Number: TW202211126443