Negative photosensitive resin composition, negative photosensitive polymer, cured film and semiconductor device

A negative photosensitive resin composition according to the present invention comprises a polyimide (A), a polyfunctional (meth)acrylate-containing cross-linking agent (B), and a photopolymerization initiator (C), wherein the polyimide (A) includes a structural unit (a1) represented by general form...

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Bibliographic Details
Main Authors IMAI, KEITA, NAKASHIMA, KAZUYA
Format Patent
LanguageChinese
English
Published 16.03.2023
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
MATERIALS THEREFOR
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:A negative photosensitive resin composition according to the present invention comprises a polyimide (A), a polyfunctional (meth)acrylate-containing cross-linking agent (B), and a photopolymerization initiator (C), wherein the polyimide (A) includes a structural unit (a1) represented by general formula (a1), a structural unit (a2) represented by general formula (a2), and a structural unit (a3) represented by general formula (a3).
Bibliography:Application Number: TW202211123674