Wafer polishing system

• Main Authors: YANG, YUAN-SI, XU, XIAO-YU, ZHOU, ZHI-PENG
• Format: Patent
• Language: Chinese; English
• Published: 16.03.2023
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING

The invention discloses a wafer polishing system which comprises at least a polishing unit. The polishing unit comprises a wafer transfer channel and at least two polishing modules, and the polishing modules are located on the two sides of the wafer transfer channel. Each polishing module comprises a polishing platform and a polishing arm, and the wafer can be driven by the polishing arm to move relative to the polishing platform, to realize the polishing process. At least two work stations are provided on the wafer transfer channel, and a wafer transfer device can be moved between said two work stations. Firstly a wafer is obtained from the work station in the wafer transfer channel through the polishing arm of the first polishing module, and the polishing process is completed; the wafer is put back to the wafer transfer channel along the first track, and the wafer transfer device is moved to transfer the wafer to the other work station; after the wafer is obtained from the work station along the second trac