Wafer polishing apparatus and wafer polishing method

• Main Authors: HSU, WENING, CHANG, CHIH-WEI, LIANG, HSIUI, YU, WEN-HUAI, WU, WEI-LI
• Format: Patent
• Language: Chinese; English
• Published: 01.03.2023
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING

A wafer polishing apparatus suitable for polishing wafer is provided. The wafer polishing apparatus includes a polishing tray, a turntable, a database, an input unit, and a control unit. The polishing tray is suitable for holding the wafer. The turntable is set up corresponding to the polishing tray. The turntable is suitable for placing a polishing pad thereon so that the polishing pad is suitable for facing the wafer. The control unit is connected to the polishing tray, turntable, database and input unit. The database stores the polishing parameter array. The polishing parameter array includes a first rotation speed corresponding to the polishing tray, a second rotation speed corresponding to the turntable, and wafer polishing data. The first rotation speed is N1 rpm. The second rotation speed is N2 rpm, wherein 30 ≤ N1 ≤ 75 or 10 ≤ N2 ≤ 60; and N1/N2=Q1, N2/N1=Q2, and both Q1 and Q2 are not natural numbers.