Compound, molded object, and cured compound

The compound according to one aspect of the present invention comprises a resin composition comprising an epoxy resin and a hardener, a nonmagnetic powder, and a magnetic powder, and has a content of the magnetic powder of 94-98 mass% with respect to the whole compound and a minimum melt viscosity a...

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Bibliographic Details
Main Authors INABA, YOSHIHITO, ENDO, YOSHINORI, YAMAGUCHI, SHOHEI, SONOKAWA, HIROKI
Format Patent
LanguageChinese
English
Published 16.02.2023
Subjects
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRICITY
INDUCTANCES
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
MAGNETS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSFORMERS
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:The compound according to one aspect of the present invention comprises a resin composition comprising an epoxy resin and a hardener, a nonmagnetic powder, and a magnetic powder, and has a content of the magnetic powder of 94-98 mass% with respect to the whole compound and a minimum melt viscosity at 175 DEG C of 10-220 Pa·s.
Bibliography:Application Number: TW202211121551