Resin composition containing curable high-molecular compound

• Main Authors: AKATSUKA, YASUMASA, HAYASHIMOTO, SHIGEO
• Format: Patent
• Language: Chinese; English
• Published: 16.02.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

The present invention provides a composition that would become a cured product. The cured product has sufficient flexibility to be formed into a film, high adhesiveness to low-roughness copper foil, low dielectric constant and dielectric tangent, and a high glass transition temperature. A resin composition according to the present inventin contains a high-molecular compound represented by the following formula (1), a styrene-butadiene copolymer or a hydride thereof, and a radical initiator. (In the formula, R1 and R2 each independently represent a hydrogen atom or a methyl group. M and n are each the mean of the number of repeating units and are each independently within the range of 1 to 2,000).