Fluorine-containing resin-based resin composition and application thereof

• Main Authors: CHAI, SONG-GANG, HAO, LIANG-PENG, LIANG, WEI, LIU, QIAN-FA, XU, YONG-JING
• Format: Patent
• Language: Chinese; English
• Published: 16.02.2023
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

The invention provides a fluorine-containing resin-based resin composition and application thereof. The fluorine-containing resin-based resin composition includes 20-70 parts by weight of polytetrafluoroethylene emulsion and 30-70 parts by weight of silicon dioxide. The silicon dioxide is prepared by an organic silicon hydrolysis method, and the purity of the silicon dioxide is greater than 99.99%. The fluorine-containing resin-based resin composition and a plate containing the fluorine-containing resin-based resin composition have excellent insulating properties and dielectric properties, lower dielectric constant and dielectric loss, and high breakdown voltage, so that a copper-clad plate exhibits excellent dielectric properties and withstand voltage, and various performance requirements of high-frequency communication equipment on a copper-clad plate material are fully met.