Apparatus for transferring electronic component, method for transferring electronic component and manufacturing method of light-emitting diode panel

• Main Authors: CHUAN, KUO-PIN, HUANG, SHENG, HUANG, SHU-HSIEN
• Format: Patent
• Language: Chinese; English
• Published: 01.02.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An apparatus for transferring electronic component is used to transfer an electronic component on a flexible carrier to a target substrate. The apparatus includes a first frame, a second frame, an abutment module, an actuator, and a negative pressure generating device. The abutment module includes an abutting element and a guide. The guide can guide the movement of the abutting element. The actuator can actuate the abutment module, so that the abutment element and the guide can move between a start position and an end position of an abutment path, respectively. The negative pressure generating device can be pumped through the abutment module. When the abutment module is pressed against the flexible carrier, a negative pressure can be generated between the abutment module and the flexible carrier by the negative pressure generating device. The abutting element and the guide move simultaneously in at least a part of the abutment path.