Electronic package and method of manufacture thereof

• Main Authors: YANG, CHIA-MING, TUNG, YUEH-MING, LI, YINGUAN, CHU, PING-HUA, CHEN, JUNG-WEI
• Format: Patent
• Language: Chinese; English
• Published: 01.02.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present invention provides an electronic package. The electronic package includes a substrate, an electronic component, a plurality of conductive elements, a metal sheet and a molding layer. The electronic component is disposed on the substrate and is electrically connected to the substrate. The...