Electronic package and method of manufacture thereof

The present invention provides an electronic package. The electronic package includes a substrate, an electronic component, a plurality of conductive elements, a metal sheet and a molding layer. The electronic component is disposed on the substrate and is electrically connected to the substrate. The...

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Bibliographic Details
Main Authors YANG, CHIA-MING, TUNG, YUEH-MING, LI, YINGUAN, CHU, PING-HUA, CHEN, JUNG-WEI
Format Patent
LanguageChinese
English
Published 01.02.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention provides an electronic package. The electronic package includes a substrate, an electronic component, a plurality of conductive elements, a metal sheet and a molding layer. The electronic component is disposed on the substrate and is electrically connected to the substrate. The conductive elements are disposed on the substrate and electrically connected with the grounding circuit on the substrate. The metal sheet is disposed above the electronic component and is in electrical contact with the conductive elements. The molding layer is formed between the substrate and the metal sheet to enclose the electronic component and the conductive elements. The present invention further provides a method of manufacturing the above electronic package.
Bibliography:Application Number: TW202110106356