Substrate processing method and substrate process apparatus

A substrate processing method is for processing a substrate that includes a first region and a second region with compositions different from each other. The substrate processing method includes (a) preferentially forming, by a substrate processing apparatus, a first deposit on the first region; (b)...

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Bibliographic Details
Main Authors MORIKITA, SHINYA, HIDAKA, AKIRA, KINO, SHU
Format Patent
LanguageChinese
English
Published 16.12.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A substrate processing method is for processing a substrate that includes a first region and a second region with compositions different from each other. The substrate processing method includes (a) preferentially forming, by a substrate processing apparatus, a first deposit on the first region; (b) forming, after (a), a second deposit on the second region, the second deposit containing fluorine and the second deposit being different from the first deposit; and (c) removing, after (b), the second deposit and at least a part of the second region. The steps (a)-(c) are repeated, in order, in a case that a stop condition is not satisfied.
Bibliography:Application Number: TW202211114007