Substrate processing system and method for processing a substrate
Embodiments of the present disclosure provide a substrate processing system. In one embodiment, the system includes a chamber, a target disposed within the chamber, a magnetron disposed proximate the target, a pedestal disposed within the chamber, and a first gas injector disposed at a sidewall of t...
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
01.12.2022
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Subjects | |
Online Access | Get full text |
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Summary: | Embodiments of the present disclosure provide a substrate processing system. In one embodiment, the system includes a chamber, a target disposed within the chamber, a magnetron disposed proximate the target, a pedestal disposed within the chamber, and a first gas injector disposed at a sidewall of the chamber, the first gas injector having a movable gas outlet. |
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Bibliography: | Application Number: TW202110128991 |