Laser processing device and laser processing method

• Main Authors: OGIWARA, TAKAFUMI, JOAN, HAYATE
• Format: Patent
• Language: Chinese; English
• Published: 01.12.2022
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

A laser processing device provided with a laser irradiation unit and a control unit, wherein the control unit is configured so as to execute: a first control in which the laser irradiation unit is controlled such that modified regions used for separation are formed along respective lines extending in an X direction, and cracks extend from the modified regions toward the surface; a second control in which, after the first control, the laser irradiation unit is controlled such that modified regions used for separation are formed along each of a plurality of lines in a Y direction, and cracks extend from the modified regions toward the surface; and a third control in which, before the second control, the laser irradiation unit is controlled such that cracks extending from a plurality of modified regions used for warping suppression reach the rear surface, and are formed without connecting to the cracks extending from the modified regions used for separation.