Plasma resistant protective layer and formation method thereof

• Main Authors: WU, TSUNG-FENG, SU, HSIU-HSIEN, LEE, WEN-LIAN, TSAI, YU-YEN, LAI, YANG-JUNG, CHOU, KUAN-TING
• Format: Patent
• Language: Chinese; English
• Published: 01.11.2022
• Subjects: APPARATUS THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

A plasma resistant protective layer and a formation method thereof are provided in the present invention. The plasma resistant protective layer is formed on a metal substrate and includes a thermal barrier coating and a plasma corrosion resistant layer. The thermal barrier coating is disposed on the metal substrate, and the plasma corrosion resistant layer disposed on the thermal barrier coating. The thermal barrier coating can improve thermal expansion and contraction of plasma cavity during operation in order to avoid the peeling off of anti-plasma corrosion materials caused by stress generated between the plasma cavity and the anti-plasma corrosion material because of different coefficient of thermal expansion. Thus, the stability of plasma resistant protective layer can be increased; the plasma corrosion can be improved; and the frequency of device maintenance can be improved.