Press-to-bond method and equipment wherein the method comprises supplying a positive-pressure gas when a plurality of pressing blocks are pressing a plurality of objects-to-be-pressed

• Main Authors: CAI, JUN-HONG, WANG, AN-TIAN
• Format: Patent
• Language: Chinese; English
• Published: 16.10.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A press-to-bond method and equipment are disclosed. The press-to-bond method comprises: supplying a positive-pressure gas when a plurality of pressing blocks press a plurality of objects-to-be-pressed, so that the pressing blocks simultaneously take a pressing force provided by the positive-pressure gas to thereby apply a positive pressure on the objects-to-be-pressed. As such, each of the objects-to-be-pressed gains a consistent quality of pressing-to-bond. Each of the objects-to-be-pressed is located on an object-to-be-transported so as to be transported along a transportation path by means of the object-to-be-transported. Each of the pressing blocks is correspondingly located above each of the objects-to-be-pressed. Each of the pressing blocks is acted upon by an elastic member to maintain a downward driving force.