Die with a die structure as well as method for its production
The invention relates to a method for the production of a structural die that has die structures for applying microstructures and/or nanostructures on substrates or soft dies, whereby the die structures consist at least partially of a die material according to the invention with low adhesion propert...
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| Main Author | |
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| Format | Patent |
| Language | Chinese English |
| Published |
01.10.2022
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| Subjects | |
| Online Access | Get full text |
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| Abstract | The invention relates to a method for the production of a structural die that has die structures for applying microstructures and/or nanostructures on substrates or soft dies, whereby the die structures consist at least partially of a die material according to the invention with low adhesion properties. |
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| AbstractList | The invention relates to a method for the production of a structural die that has die structures for applying microstructures and/or nanostructures on substrates or soft dies, whereby the die structures consist at least partially of a die material according to the invention with low adhesion properties. |
| Author | CHOUIKI, MUSTAPHA |
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| Notes | Application Number: TW202211123308 |
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| PublicationDateYYYYMMDD | 2022-10-01 |
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| PublicationYear | 2022 |
| RelatedCompanies | EV GROUP E. THALLNER GMBH |
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| Snippet | The invention relates to a method for the production of a structural die that has die structures for applying microstructures and/or nanostructures on... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING |
| Title | Die with a die structure as well as method for its production |
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