Die with a die structure as well as method for its production

The invention relates to a method for the production of a structural die that has die structures for applying microstructures and/or nanostructures on substrates or soft dies, whereby the die structures consist at least partially of a die material according to the invention with low adhesion propert...

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Bibliographic Details
Main Author CHOUIKI, MUSTAPHA
Format Patent
LanguageChinese
English
Published 01.10.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:The invention relates to a method for the production of a structural die that has die structures for applying microstructures and/or nanostructures on substrates or soft dies, whereby the die structures consist at least partially of a die material according to the invention with low adhesion properties.
Bibliography:Application Number: TW202211123308