Semiconductor device and wiring structure suitable for efficiently laying out the wiring on each wiring layer

• Main Authors: HASEGAWA, TOMOHIRO, NAKAO, KOUJI, NASU, HIROSHI
• Format: Patent
• Language: Chinese; English
• Published: 16.09.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

One embodiment of the present invention provides a semiconductor device and a wiring structure suitable for efficiently laying out the wiring on each wiring layer. According to one embodiment, in the semiconductor device, the first wiring extends along the first wiring track arranged on the outside....