Semiconductor device and wiring structure suitable for efficiently laying out the wiring on each wiring layer

• Main Authors: HASEGAWA, TOMOHIRO, NAKAO, KOUJI, NASU, HIROSHI
• Format: Patent
• Language: Chinese; English
• Published: 16.09.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

One embodiment of the present invention provides a semiconductor device and a wiring structure suitable for efficiently laying out the wiring on each wiring layer. According to one embodiment, in the semiconductor device, the first wiring extends along the first wiring track arranged on the outside. The first wiring is electrically connected to the first via plug configured under the first wiring track. The second wiring extends along the second wiring track arranged on the inside. The second wiring extends from the second wiring track to the first wiring track and is electrically connected to the second via plug configured under the first wiring track. The third wiring extends along the third wiring track arranged on the outside. The third wiring track is arranged on the opposite side of the first wiring track. The third wiring extends from the third wiring track to the first wiring track via the second wiring track and is electrically connected to the third via plug configured under the first wiring track.