Substrate treatment method and substrate treatment device

• Main Authors: YAMAGUCHI, TAKAHIRO, OKITA, YUJI, ENDO, TORU, ISHIMARU, AKIRA, HIGASHI, KATSUEI, TSUKAHARA, RYUTA, NAOHARA, HIDEJI
• Format: Patent
• Language: Chinese; English
• Published: 16.09.2022
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES

This substrate treatment method includes: a substrate holding step for holding a substrate at a holding position surrounded by a cylindrical guard; a treatment liquid supply step for supplying a treatment liquid for treating a to-be-treated surface of the substrate to the to-be-treated surface of the substrate while rotating the substrate held at the holding position about a rotation axis passing through the center of the substrate; an image acquisition step for acquiring an image of the to-be-treated surface of the substrate and an image of the inner wall surface of the guard while the treatment liquid is supplied to the to-be-treated surface of the substrate; and a detection step for monitoring the luminance values of the images acquired in the image acquisition step and detecting a treatment end time point at which treatment of the to-be-treated surface of the substrate by use of the treatment liquid is ended.