Heat dissipation module and storage device

A heat dissipation module and a storage device are provided. The heat dissipation module is used to fix a hard drive body on a circuit board and includes a first fixing element and a heat dissipating element. The first fixing element includes a top and a bottom. The bottom is used to fix the hard dr...

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Bibliographic Details
Main Authors CHEN, CHIEN-PANG, SHAO, MING-WEI, DING, BAI-HENG
Format Patent
LanguageChinese
English
Published 16.08.2022
Subjects
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Summary:A heat dissipation module and a storage device are provided. The heat dissipation module is used to fix a hard drive body on a circuit board and includes a first fixing element and a heat dissipating element. The first fixing element includes a top and a bottom. The bottom is used to fix the hard drive body on the circuit board. The heat dissipating element includes at least one connection portion. The connection portion is pivoted on the top of the first fixing element. The storage device is used to be fixed on the circuit board and includes a main body, a first fixing element and a heat dissipating element. The main body includes an end portion and an electronic element. The first fixing element includes a top and a bottom. The bottom is used to be fixed on the circuit board. The heat dissipating element is connected to the electronic element of the main body and includes a connection portion. The connection portion is pivoted on the top of the first fixing element.
Bibliography:Application Number: TW202110103964