Wiring circuit board

This wiring circuit board (X1) comprises a metal support substrate (10), an insulating layer (20), and a conductor layer (30) in this order in the thickness direction (T). The conductor layer (30) includes at least one terminal section (31) and a wiring section (32) extending from the terminal secti...

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Bibliographic Details
Main Authors NIINO, TEPPEI, TAMAKI, YUSAKU, SHIBATA, SHUSAKU
Format Patent
LanguageChinese
English
Published 01.08.2022
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INFORMATION STORAGE
INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
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Summary:This wiring circuit board (X1) comprises a metal support substrate (10), an insulating layer (20), and a conductor layer (30) in this order in the thickness direction (T). The conductor layer (30) includes at least one terminal section (31) and a wiring section (32) extending from the terminal section (31). The metal support substrate (10) has an opening (10A) therein. The opening (10A) passes through the metal support substrate (10) in the thickness direction (T) and faces the terminal section (31) with the insulating layer (20) therebetween. The opening (10A) has a first opening peripheral edge (11) on one side in the thickness direction (T) and a second opening peripheral edge (12) on the other side in the thickness direction (T). The second opening peripheral edge (12) is arranged outside of the first opening peripheral edge (11) and extends along the first opening peripheral edge (11) in a projection view of the thickness direction (T).
Bibliography:Application Number: TW202110145211