A lead frame and package used in electronic product

A lead frame of electronic product and a semiconductor package is disclosed, said lead frame includes a lead, said lead also enables to include either an opening which is situated at a suitable place on said lead or an extending portion, in case that a portion of encapsulant received in said opening...

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Bibliographic Details
Main Author WANG, CHUNG-PAO
Format Patent
LanguageChinese
English
Published 01.08.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A lead frame of electronic product and a semiconductor package is disclosed, said lead frame includes a lead, said lead also enables to include either an opening which is situated at a suitable place on said lead or an extending portion, in case that a portion of encapsulant received in said opening so as to be coupled with the lead more securely, then it prevents said lead from the damage of peeling off caused by external force; when a chip is electrically connected to said lead by a conductive mean such as a bump, and the tin of said bump is placed in said opening, a solder material such as solder ball coupled with both the lower surface of lead and the tin of said bump, it can avoid the problem of IMC(intermetallic compound) occurred between said solder ball and said bump, then the reliability of the semiconductor package is enhanced.
Bibliography:Application Number: TW20209147107