Microelectronic assemblies with inductors in direct bonding regions

Disclosed herein are microelectronic assemblies including microelectronic components that are coupled together by direct bonding, as well as related structures and techniques. For example, in some embodiments, a microelectronic assembly may include a first microelectronic component and a second micr...

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Main Authors PASDAST, GERALD S, EID, FERAS, ELSHERBINI, ADEL A, LIFF, SHAWNA M, BHARATH, KRISHNA, THEN, HAN WUI, O'BRIEN, KEVIN P, JUN, KI-MIN, KABIR, MOHAMMAD ENAMUL, ALEKSOV, ALEKSANDAR, SWAN, JOHANNA M
Format Patent
LanguageChinese
English
Published 16.07.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Disclosed herein are microelectronic assemblies including microelectronic components that are coupled together by direct bonding, as well as related structures and techniques. For example, in some embodiments, a microelectronic assembly may include a first microelectronic component and a second microelectronic component coupled to the first microelectronic component by a direct bonding region, wherein the direct bonding region includes at least part of an inductor.
Bibliography:Application Number: TW20210129622