Conveying and bonding method and device for heat dissipation adhesive pad suitable for conveying and bonding sheet-like heat dissipation adhesive pad

• Main Authors: WANG, XUAN-XIANG, CHENG, GUAN-LIN, WANG, AN-TIAN, KE, YOU-LIAN
• Format: Patent
• Language: Chinese; English
• Published: 16.07.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present invention relates to a conveying and bonding method and device for heat dissipation adhesive pad. The conveying method for heat dissipation adhesive pad includes: covering and bonding a first release film on the upper surface of a heat dissipation adhesive pad and covering and bonding a second release film on the lower surface to provide a heat dissipation adhesive assembly; next, adhering an adhesive surface of an adhesive tape of a bonding device to the first release film above, so the heat dissipation adhesive assembly may be picked and conveyed by having the second release film facing downward, and removing the second release film during the conveying process; and, after the heat dissipation adhesive pad is bonded onto a bonded object, picking and removing the first release film away from the heat dissipation adhesive pad by the adhesive tape; thus, the sheet-like heat dissipation adhesive pad may be bonded onto the bonded object.