Method for manufacturing resin compact

• Main Author: KAGAWA, SHINGO
• Format: Patent
• Language: Chinese; English
• Published: 16.07.2022
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The present invention addresses the problem of providing a method for more simply manufacturing a resin compact in which areas with different properties or of different materials are placed at desired positions and molded integrally. This problem is solved with a method for manufacturing a resin compact, the method comprising: a placement step in which a plurality of ingredients are prepared, including a material X and a solid resin member A which comprises at least in part a thermoplastic resin a, the ingredients are each placed at a desired location within a mold, and a charged mold is obtained; and a molding step in which the charged mold is irradiated with electromagnetic waves, or the charged mold is placed within an alternating electric field, so that at least a part of the thermoplastic resin a in the charged mold is melted, and a processed mold that includes a resin compact in which the resin member A and the material X are joined is obtained.