Bulk-acoustic wave resonator package
A bulk-acoustic wave resonator package includes a package substrate; a cover bonded to the package substrate; an acoustic wave resonator accommodated in an accommodation space defined by the package substrate and the cover; a conductive wire disposed in the accommodation space to electrically connec...
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Main Authors | , , , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
01.07.2022
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Subjects | |
Online Access | Get full text |
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Abstract | A bulk-acoustic wave resonator package includes a package substrate; a cover bonded to the package substrate; an acoustic wave resonator accommodated in an accommodation space defined by the package substrate and the cover; a conductive wire disposed in the accommodation space to electrically connect the acoustic wave resonator to the package substrate; and a bonding portion to fixedly couple the acoustic wave resonator to the package substrate. The bonding portion includes an adhesive member including silicon. |
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AbstractList | A bulk-acoustic wave resonator package includes a package substrate; a cover bonded to the package substrate; an acoustic wave resonator accommodated in an accommodation space defined by the package substrate and the cover; a conductive wire disposed in the accommodation space to electrically connect the acoustic wave resonator to the package substrate; and a bonding portion to fixedly couple the acoustic wave resonator to the package substrate. The bonding portion includes an adhesive member including silicon. |
Author | LEE, TAE-KYUNG SON, JIN-SUK LEE, YEONG-GYU LEE, MOONUL NA, SEONG-HUN PARK, SEUNG-WOOK JUNG, JAE-HYUN AUM, JAE-GOON |
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Snippet | A bulk-acoustic wave resonator package includes a package substrate; a cover bonded to the package substrate; an acoustic wave resonator accommodated in an... |
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SubjectTerms | BASIC ELECTRONIC CIRCUITRY ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS |
Title | Bulk-acoustic wave resonator package |
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