Bulk-acoustic wave resonator package

A bulk-acoustic wave resonator package includes a package substrate; a cover bonded to the package substrate; an acoustic wave resonator accommodated in an accommodation space defined by the package substrate and the cover; a conductive wire disposed in the accommodation space to electrically connec...

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Bibliographic Details
Main Authors PARK, SEUNG-WOOK, LEE, MOONUL, LEE, YEONG-GYU, NA, SEONG-HUN, AUM, JAE-GOON, JUNG, JAE-HYUN, SON, JIN-SUK, LEE, TAE-KYUNG
Format Patent
LanguageChinese
English
Published 01.07.2022
Subjects
BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
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Summary:A bulk-acoustic wave resonator package includes a package substrate; a cover bonded to the package substrate; an acoustic wave resonator accommodated in an accommodation space defined by the package substrate and the cover; a conductive wire disposed in the accommodation space to electrically connect the acoustic wave resonator to the package substrate; and a bonding portion to fixedly couple the acoustic wave resonator to the package substrate. The bonding portion includes an adhesive member including silicon.
Bibliography:Application Number: TW202110134822