Silicone resin composition, molded article, laminate and molded article manufacturing method having high pencil hardness, scratch resistance and bending resistance

• Main Authors: SAITO, TAKASHI, KAWATANI, TOSHIHIRO
• Format: Patent
• Language: Chinese; English
• Published: 01.07.2022
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The present invention provides a photocurable silicone resin composition that can obtain a molded article having high pencil hardness, scratch resistance and bending resistance, and a silicone resin molded article obtained by curing it as a three-dimensional cross-linked body. A photocurable silicone resin composition is characterized in that it is prepared in a mass ratio of 1-50:10-40:10-80 of a reactive silicone resin (A); a polyfunctional alkylene oxide modified unsaturated compound (B) containing in one molecule at least two-R3-CR4=CH2 or-CR4=CH2 [wherein, R3 represents alkylene, alkylene or-O-C(=O)-group, R4 represents hydrogen atom or alkyl group] unsaturated group and further having an alkylene oxide modified site; and a polyfunctional unsaturated compound (C) that contains two or more of the unsaturated groups in one molecule and does not contain an alkylene oxide modification site.