Etching agent and circuit board manufacturing method

• Main Authors: FUKUI, YU, NAKANE, DAI, NISHIE, KENJI, AKIYAMA, DAISAKU
• Format: Patent
• Language: Chinese; English
• Published: 16.06.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; PRINTED CIRCUITS

The present invention is an etching agent that selectively etches a copper layer of a treatment object in which a noble metal layer containing a metal nobler than copper and a copper layer coexist, the etching agent contains: copper ions, one or more nitrogen-containing compounds selected from the group consisting of heterocyclic compounds having two or more nitrogen atoms in the ring and amino group-containing compounds having 8 or less carbon atoms, polyalkylene glycol, and halogen ions; the etching agent contains 0.0005% by weight or more and 7% by weight or less of polyalkylene glycol and 1 ppm or more and 250 ppm or less of halogen ions.