Multilayer body for electronic curcuit boards

A multilayer body for electronic circuit boards, said multilayer body having a copper layer on at least one surface of a resin layer which contains a styrene resin that has a syndiotactic structure. With respect to this multilayer body for electronic circuit boards, a surface of the copper layer, sa...

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Bibliographic Details
Main Author IWAMOTO, TAKEHIRO
Format Patent
LanguageChinese
English
Published 16.06.2022
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
PERFORMING OPERATIONS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
TRANSPORTING
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Summary:A multilayer body for electronic circuit boards, said multilayer body having a copper layer on at least one surface of a resin layer which contains a styrene resin that has a syndiotactic structure. With respect to this multilayer body for electronic circuit boards, a surface of the copper layer, said surface being in contact with the resin layer, has an average roughness (Ra) of from 0.20 [mu]m to 0.60 [mu]m, and a maximum height of roughness (Rz) of from 1.20 [mu]m to 6.00 [mu]m.
Bibliography:Application Number: TW202110139654