Light-emitting package and method of manufacturing the same

A light-emitting package includes a black encapsulating member, a plurality of light-emitting components and a circuit structure. The black encapsulating member has a first surface and a second surface opposite to the first surface. The light-emitting components are embedded in the black encapsulati...

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Bibliographic Details
Main Authors LEE, TZU-NIEN, YANG, KAI-MING, LIN, CHEN-HAO
Format Patent
LanguageChinese
English
Published 01.05.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A light-emitting package includes a black encapsulating member, a plurality of light-emitting components and a circuit structure. The black encapsulating member has a first surface and a second surface opposite to the first surface. The light-emitting components are embedded in the black encapsulating member. Each light-emitting component has a light-emitting surface, a back surface opposite to the light-emitting surface, and a plurality of pads disposed on the back surface. The light-emitting surface of each light-emitting component is exposed on the first surface and is flush with the first surface. The pads of each light-emitting component are exposed on the second surface. The circuit structure is disposed on the second surface and electrically connected to the pads.
Bibliography:Application Number: TW20209136750